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As electronic devices are getting smaller and faster, they are also resulting in more heat build-up within the system. You want to protect your equipment from slower speeds, less reliability, or—the unspeakable—complete failure. An efficient thermal management system consists of three components:
The interface gap is inevitable because of the micro-gaps and voids between the two mating surfaces. Optimal performance of the heat dissipation system requires the air voids be filled with a thermally conductive interface product.
The following recommended steps will help you determine the correct thermal interface material for your application:
| Sil-Pad®KA-10 | Gap Pad™ VOUltra Soft | Sil-Pad®A2000 | Hi-Flow™625 | Hi-Flow™225 F-AC | |
|---|---|---|---|---|---|
| Thermal Resistance C -in2/W | 0.2 | 2.0 - 12.0 | 0.02 | 0.25 | 0.25 |
|
Thermal |
1.3 W/m K | 1 W/m K | 3.5 W/m K | 1.0 W/m K | 1.0 W/m K |
| Dielectric Breakdown Voltage | 5000 AC-min. | >6kV | 4000 AC-min. | 4000 volt | N/A |
| Dielectric Constant | 5 | 5.5 | 7 | 3.5 | N/A |
| Continuous Use Temp. | -60°C to 150°C | -60°C to 200°C | -60°C to 200°C | 150°C | 120°C |
| Description | Excellent thermal erformance with ood cut-through properties | High conformity allows this pad to fill void and gaps between heat sinks and metal chassis | Highly preferred, high reliability | Electrically isolating, easy to handle phase change material without shipping or handling problems | High performance thermal interface grease replacement |